Avnet

About the Role:

We are seeking a motivated Junior Package Engineer with PCB design experience to join our IC packaging and signal/power integrity team.

You will support the development of advanced semiconductor packages and perform SI/PI analysis for high-speed interfaces such as Ethernet, PCIe, DDR, and SerDes.

Responsibilities:

• Assist in IC package design (substrate layout, stack-up, routing, DRC checks)
• Support package floorplanning and die/ball map development
• Work with senior engineers to run SI simulations (S-parameters, insertion loss, eye diagrams)
• Perform PI/PDN analysis (IR drop, decap planning, impedance profiles)
• Translate PCB experience into package-level routing constraints (differential pair rules, impedance control)
• Help model high-speed interfaces: Ethernet, PCIe, DDR, SerDes
• Collaborate with silicon, system, and PCB teams on end-to-end interconnect design
• Document design guidelines, simulation results, and engineering reports

Required Qualifications:

• Experience with PCB design tools (Altium, OrCAD, Allegro, KiCad, or similar)
• Understanding of high-speed differential routing and board-level signal integrity basics
• Familiarity with impedance control, vias, stackups, return paths, PDN concepts
• Exposure to interfaces such as Ethernet, PCIe, DDR
• Basic scripting or automation skills (Python/Matlab preferred)
• Strong problem-solving abilities and attention to detail
• High motivation to learn package design and SI/PI methodologies
• Nice-to-Have Skills
• Familiarity with package design tools: Cadence SIP/APD, Xpeedic, Mentor Xpedition
• Exposure to SI/PI simulation tools: ANSYS SIwave, HFSS, Sigrity, ADS
• Understanding of flip-chip, BGA, RDL, 2.5D/3D packaging

• Knowledge of SerDes, USB, LPDDR, or high-speed PHY design principles

   

What We Offer: 

• Full training in IC packaging, SI/PI analysis, and advanced interconnect design
• Opportunity to work with cutting-edge technologies (PCIe Gen5/6, DDR5/6, chiplets)
• Mentorship from senior package, SI, and system engineers
• A clear growth path toward package architect, SI/PI lead, or chiplet interconnect specialist

About the Role:

We are seeking a motivated Junior Package Engineer with PCB design experience to join our IC packaging and signal/power integrity team.

You will support the development of advanced semiconductor packages and perform SI/PI analysis for high-speed interfaces such as Ethernet, PCIe, DDR, and SerDes.

Responsibilities:

• Assist in IC package design (substrate layout, stack-up, routing, DRC checks)
• Support package floorplanning and die/ball map development
• Work with senior engineers to run SI simulations (S-parameters, insertion loss, eye diagrams)
• Perform PI/PDN analysis (IR drop, decap planning, impedance profiles)
• Translate PCB experience into package-level routing constraints (differential pair rules, impedance control)
• Help model high-speed interfaces: Ethernet, PCIe, DDR, SerDes
• Collaborate with silicon, system, and PCB teams on end-to-end interconnect design
• Document design guidelines, simulation results, and engineering reports

Required Qualifications:

• Experience with PCB design tools (Altium, OrCAD, Allegro, KiCad, or similar)
• Understanding of high-speed differential routing and board-level signal integrity basics
• Familiarity with impedance control, vias, stackups, return paths, PDN concepts
• Exposure to interfaces such as Ethernet, PCIe, DDR
• Basic scripting or automation skills (Python/Matlab preferred)
• Strong problem-solving abilities and attention to detail

• High motivation to learn package design and SI/PI methodologies

   

  Nice-to-Have Skills

• Familiarity with package design tools: Cadence SIP/APD, Xpeedic, Mentor Xpedition
• Exposure to SI/PI simulation tools: ANSYS SIwave, HFSS, Sigrity, ADS
• Understanding of flip-chip, BGA, RDL, 2.5D/3D packaging

• Knowledge of SerDes, USB, LPDDR, or high-speed PHY design principles

   

What We Offer: 

• Full training in IC packaging, SI/PI analysis, and advanced interconnect design
• Opportunity to work with cutting-edge technologies (PCIe Gen5/6, DDR5/6, chiplets)
• Mentorship from senior package, SI, and system engineers
• A clear growth path toward package architect, SI/PI lead, or chiplet interconnect specialist

About the Role:

We are seeking a motivated Junior Verification Engineer to join our VLSI design and verification team.

This is an excellent opportunity for new graduates with strong academic training in digital design, verification methodologies, and SystemVerilog/UVM.

Responsibilities:

Develop and execute verification testbenches using Verilog/SystemVerilog and UVM

Implement functional and constrained-random tests for block-level and SoC-level designs

Create coverage models (functional, code, assertion-based) and drive coverage closure

Debug simulation failures, interface mismatches, and RTL issues

Write and maintain scoreboards, monitors, agents, drivers, and checkers in UVM

Review design specifications, extract test requirements, and build verification plans

Run regressions, triage failures, and document results

Collaborate closely with RTL designers, DFT, backend, and system architects

Required Qualifications:

B.Sc. or M.Sc. in Electrical/Computer Engineering or related field

Strong academic background in digital logic, computer architecture, and VLSI design

Hands-on experience with Verilog and SystemVerilog (labs, projects, internship)

Basic understanding of UVM methodology

Familiarity with simulation tools (VCS, QuestaSim, Xcelium or similar)

Ability to read and understand RTL code

Good analytical and debugging skills

Strong motivation to grow in advanced functional verification

Nice-to-Have Skills:

Coursework or project experience with UVM testbench development

Familiarity with assertion-based verification (SVA)

Basic scripting (Python, Perl, Shell, TCL)

Experience with coverage-driven verification

Exposure to SoC-level interfaces (AXI, PCIe, DDR, Ethernet, SPI, I2C)

What We Offer:

Full training in modern verification methodologies (UVM, SVA, CRV)

Work with cutting-edge IPs and SoC architectures

Mentorship from senior verification and architecture teams

Clear growth path toward UVM specialist, verification lead, or architect

We are looking for highly motivated junior engineers to join our Design-for-Test (DFT) team.

This is an excellent opportunity for graduates who want to build expertise in Scan, Memory BIST, and JTAG within advanced VLSI development.

Responsibilities:

Learn and support implementation of scan insertion and scan chain architecture

Assist in ATPG pattern generation and test coverage analysis

Participate in Memory BIST (MBIST) integration and verification

Work with JTAG / IEEE 1149.1 boundary scan concepts and flows

Help debug test-related issues at RTL and gate level

Collaborate with senior DFT engineers on SoC-level test strategy

Required Background:

Academic knowledge in digital logic, VLSI design, and computer architecture

Basic familiarity with DFT concepts: scan, ATPG, BIST, boundary scan

Understanding of Verilog or VHDL

Scripting basics (Python, TCL, Shell)

Good analytical and problem-solving skills

Strong motivation to learn industry-standard DFT tools and flows

What We Offer:

Full training in Scan, MBIST, JTAG, ATPG, and DFT methodologies

Mentorship by experienced DFT engineers

Exposure to advanced SoC development flows and signoff

Growth path toward senior DFT, test architecture, or silicon bring-up roles

About the Role:

We are seeking a motivated Junior Package Engineer with PCB design experience to join our IC packaging and signal/power integrity team.

You will support the development of advanced semiconductor packages and perform SI/PI analysis for high-speed interfaces such as Ethernet, PCIe, DDR, and SerDes.

Responsibilities:

• Assist in IC package design (substrate layout, stack-up, routing, DRC checks)
• Support package floorplanning and die/ball map development
• Work with senior engineers to run SI simulations (S-parameters, insertion loss, eye diagrams)
• Perform PI/PDN analysis (IR drop, decap planning, impedance profiles)
• Translate PCB experience into package-level routing constraints (differential pair rules, impedance control)
• Help model high-speed interfaces: Ethernet, PCIe, DDR, SerDes
• Collaborate with silicon, system, and PCB teams on end-to-end interconnect design
• Document design guidelines, simulation results, and engineering reports

Required Qualifications:

• Experience with PCB design tools (Altium, OrCAD, Allegro, KiCad, or similar)
• Understanding of high-speed differential routing and board-level signal integrity basics
• Familiarity with impedance control, vias, stackups, return paths, PDN concepts
• Exposure to interfaces such as Ethernet, PCIe, DDR
• Basic scripting or automation skills (Python/Matlab preferred)
• Strong problem-solving abilities and attention to detail

• High motivation to learn package design and SI/PI methodologies

   

  Nice-to-Have Skills

• Familiarity with package design tools: Cadence SIP/APD, Xpeedic, Mentor Xpedition
• Exposure to SI/PI simulation tools: ANSYS SIwave, HFSS, Sigrity, ADS
• Understanding of flip-chip, BGA, RDL, 2.5D/3D packaging

• Knowledge of SerDes, USB, LPDDR, or high-speed PHY design principles

   

What We Offer: 

• Full training in IC packaging, SI/PI analysis, and advanced interconnect design
• Opportunity to work with cutting-edge technologies (PCIe Gen5/6, DDR5/6, chiplets)
• Mentorship from senior package, SI, and system engineers
• A clear growth path toward package architect, SI/PI lead, or chiplet interconnect specialist

Role Overview
We are looking for a hands-on, independent Operations Manager to take full ownership of NPI and production operations — including project execution, procurement, supplier management,
planning, and profitability.
This is a decision-making role for someone who thrives on execution and accountability, can manage complex projects end-to-end, and is comfortable working across customers, vendors, and internal teams in a fast-paced, dynamic environment with constant change and uncertainty. The ideal candidate is both resilient and proactive — someone who takes initiative, solves problems, and gets things done.

Key Responsibilities: 

1. Lead and manage NPI and mass production projects from planning to delivery — including scoping, budgeting, execution, and schedule tracking.
2. Own the operational plan for each project, including procurement strategy, vendor
engagement, and cross-functional coordination with technical and NPI teams.
3. Coordinate test department activities to meet project goals, ensuring timelines, readiness, and issue resolution are aligned with customer needs.
4. Serve as the main operational point of contact for customers — managing forecasts, orders, logistics, invoicing, and ongoing communication.
5. Manage suppliers and subcontractors across the full lifecycle — quotations, negotiations, procurement, capacity planning, production setup, quality processes, and project control.
6. Develop internal tools and automation to streamline operations and quotation processes (e.g., for silicon, packaging).
7. Act as the ERP super-user — lead implementation of new features, ensure system integrity, and drive operational data quality.
8. Ensure compliance with ISO processes and manage export control activities in collaboration with internal and external stakeholders.
9. Interface with the finance team to track and report project and order-level profitability on a monthly basis.

Key Qualifications:
 3–5 years of experience in operations, NPI, or technical project management (preferably in hardware/semiconductors)
 Strong hands-on execution capabilities, combined with independent ownership and decision-making
 Experience in customer-facing project/account management roles
 Background in procurement, production planning, and vendor negotiations
 Proficiency with ERP systems (purchasing or operations modules preferred)
 Fluent in English (spoken and written); advanced Excel skills
 Detail-oriented with strong multitasking and organizational skills
 Ability to lead cross-functional efforts and work with multiple stakeholders

 Thrives in dynamic, fast-moving environments; effective in navigating constant change and uncertainty

Preferred Experience:
 Worked in a mid-sized or small high-tech company with broad responsibilities
 Experience in subcontractor management, logistics, and quality systems
 Familiarity with ASIC or semiconductor development
 Experience in writing SOWs (Statements of Work), reviewing contracts, or managing budgets

We design integrated circuits for consumer, medical and automotive markets. The majority of these designs are complex SoC/ASIC architectures that integrate IPs, such as ARM and RISC-V CPUs and peripherals, DSP cores, analog cells and other IPs with progressive technology nodes: 24, 10, 7,  3 nanometers.

In our daily work we constantly face challenges that requires out of box thinking. This makes our lives an interesting and challenging adventure. Such attitude permits creation of products full of features that often outperform market. We are constant learners, the same we expect from our new employees. Hence, we’d be happy to meet passionate and keen on learning, bright young individuals.

Below is a brief list of skills/knowledge that ideally suit our job profile. Still it’s not an issue if you don’t possess some of those. To our opinion the fundamental engineer’s skills are problem solving and ability to learn.

Desired knowledge you may possess:

• Good understanding of digital/analog electronics and semiconductors physics
• FPGA placement and routing using EDA tools
• Experience with PCB design using such tools such as OrCAD, Altium Designer or similar
• Basic knowledge of scripting languages such as Tcl, Python, Make
• Beginner’s level of English

Optional skills you may have:

• FPGA design using HDLs or schematics editor
• Embedded systems design using IDEs such as Keil, AtmelStudio, IAR

We offer:

• Part- or full-time employment, flexible schedule
• On-job training in our Kyiv office with high skilled professionals
• Potential growth in the direction of ASIC design
• Paid sick leave and vacation

We design integrated circuits for consumer, medical and automotive markets. The majority of these designs are complex SoC/ASIC architectures that integrate IPs, such as ARM and RISC-V CPUs and peripherals, DSP cores, analog cells and other IPs with progressive technology nodes: 14, 10, 8, 7 nanometers.

You will be responsible for digital logic design and verification. Besides, you'd be able to learn and improve related methodologies. Below is a brief list of skills/knowledge that ideally suit our job profile. Still it’s not an issue if you don’t possess some of those. To our opinion the fundamental engineer’s skills are analytical thinking and ability to learn.

Essential qualifications:

-Degree in Electronics or related fields

-Good understanding of digital electronics

-Experience with EDA tools (Xilinx, Mentor Graphics, Synopsys or similar)

-Beginner’s level of English or higher

Optional qualifications you may have:

-FPGA design using HDL (Verilog, VHDL) or schematics editor

-IC design verification using System Verilog

-CPU architecture knowledge, embedded SW development

We offer:

-Full-time employment, flexible schedule

-On-job training in our Kyiv office with high skilled professionals

-Potential growth in directions of ASIC/FPGA design

-Social benefits, modern and comfortable office facilities